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Home > Technical Platforms > Technologic platform for photonic integrated circuits (CCLO)

Technologic platform for photonic integrated circuits (CCLO)


Scientific coordinator: Mohammed GUENDOUZ
Technical coordinator: Parastesh PIRASTEH

The CCLO is a research technology platform dedicated to the realization and characterization of integrated optical circuits. The CCLO is part of the Renatech+ network and it is a regional platform supported by the CNRS. It is a technological support for research projects of the Foton Institute. It is part of several local, regional and national cooperative projects.

The platform is constituted of cleanrooms for the realization of PICs. The instruments available for the micro-technology and physical characterizations are summarized: Resolution photolithography to 0.5 µm linewidth (KarlSüss-MJB4 mask aligners), Physical vapor deposition of dielectric (e.g. silicon dioxide, silicon nitride) and metallic films (Plassys MP550S), E-gun evaporation of metallic films (EVA300), Plasma etching by RIE and ICP method (Corial 200I), wet chemical etching, High thermo-oxidation.

The technological expertise of the platform covers a wide field of processed materials to fabricate PICs for optical communication and sensing applications. Currently, the studied materials are polymers films (with variable refractive index), chalcogenides layers (doped or not doped), germanium layers and nanostructured semiconductors (porous silicon) and porous silica.

The platform is also focused on structural and physic characterizations in the visible to mid-infrared wavelength range. It is equipped by m-lines set-up (Metricon) to measure the layers refractive index, Raman Spectrophotometer (Horiba JY-HR800), UV - Visible - Near IR Spectrophotometer (Perkin Elmer, Ocean Optics), Scanning Electron Microscopy (HITACHI-SU3500) and Optical Microscope.

Examples of fabricated integrated structures


The CCLO also offers services to industrial and academic partners in the field of thin film technologies and the characterization of materials and components.